Dow Corning Earns Prestigious 3D InCites Award for New Thermally Conductive Gel for Advanced Semiconductor Packaging Applications


Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it garnered a 2015 3D InCites Award for new Dow Corning TC-3040 Thermally Conductive Gel, a silicone-based thermal interface material (TIM 1) designed to manage heat and support reliable performance for advanced semiconductor flip chip applications. Selected by a panel of 12 judges from industry, academia and the technical community, Dow Corning TC-3040 Thermally Conductive Gel won the top award in the 3D Materials category. Members of the Dow Corning team accepted the award at a well-attended awards ceremony held during SEMICON West 2015 in San Francisco in July.

“Advanced flip chip packaging applications have put intense pressure on integrated circuit chipmakers to find new and better ways to manage potentially damaging heat in these devices, and Dow Corning is proactively developing solutions to help customers meet these challenges today and in the years ahead,” said Andrew Ho, global market segment leader at Dow Corning. “We are very proud of the teamwork and collaborative innovation with industry partners that helped the development of our cutting-edge TC-3040 Thermally Conductive Gel.”

A one-part silicone technology, Dow Corning TC-3040 Thermally Conductive Gel’s excellent heat management capabilities deliver nearly two times the thermal performance of other industry standard TIMs, and enables it to regulate the harsh, high-temperature extremes in semiconductor packages. It features a combination of low modulus and high elongation, which prevents warpage and delamination. It also provides good wetting for excellent interfacial contact between the chip and lid, and can accommodate high filler loadings for enhanced thermal performance.

Dow Corning TC-3040 Gel is easily processed and compatible with standard substrates, lids, heat sinks and other flip chip-related materials and offers flexible cure options, including the ability to cure at low temperatures. It can be easily applied to achieve thin bond lines and provides excellent under-die coverage.

The 3D InCites Awards program recognizes achievements to further the commercialization of 3D integration technologies. Awards are presented to companies whose innovative products have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D ICs, monolithic 3D, 3D memory and 3D heterogeneous integration. In 2015, 3D InCites Awards were presented in the following categories:

  • Devices
  • Design Tools
  • Materials
  • Manufacturing Equipment
  • Inspection/Metrology Tools

Proceeds from the event go to support STEM-related educational programs and scholarships.